Automated Coating Three-Piece Set Equipment
Automated three-piece set for crystalline silicon tandem perovskite solar cell coating, specially designed for functional layer coating on 182mm*182mm silicon wafers.
This system includes: Coater (with solution supply system), environmental enclosure (clean dust removal, with organic solvent treatment device), silicon wafer handling robot mechanism, VCD flash extraction equipment, stack furnace annealing equipment, and electrical control unit, etc.
This system performs fully automatic wafer pickup from a cassette lift, then completes coating -> VCD vacuum solvent extraction -> stack furnace annealing, and finally unloads back into the cassette – all three processes are fully automated.
Technical Specifications
| Coater | |
| Overall External Dimensions (mm) | 1880*1550*2200 |
| Substrate Size (mm) | 182*182 |
| Die Automatic Adjustment Accuracy (μm) | 2 |
| Speed Control Range (mm/s) | 1-200 |
| Coated Dry Film Thickness (nm) | 10-800 |
| Coating Solution Solid Content (%) | 1-70 |
| |Coating Solution Viscosity (cps) | 1-100 |
| |Production Takt Time (pcs/h) | ≥60 |
| VCD Flash Extraction Equipment | |
| Evacuation Method | Bottom evacuation |
| Loading/Unloading Method | Manual/Automatic switchable |
| Substrate Specification | 182mm*182mm silicon wafer, thickness ≥100um |
| Evacuation Time | ATM-10Pa≤I0s |
| Ultimate Vacuum | ≤1Pa |
| Leak Rate | ≤1*10-9Pa*m³ /s |
| Vent Time | 10Pa-ATM:5-10s adjustable |
| Takt Time | 60s |
| MFC N2 Flow Rate | 0-2SLM adjustable |
| Stack Furnace Annealing Equipment | |
| Product Size | ≥200*200am |
| Process Chamber Max Temperature | 200℃ |
| Process Operating Temperature Range | RT~200℃ |
| Within Substrate | ≤士3%℃ |
| Between Substrates | ≤士3%℃ |
| Temperature Accuracy | ≤士1℃ |
| Chamber Heating Rate | RKT-150℃≤8min |
- Need a customized technical solution?
- Honest Intelligent's technical team has a strong industrial background and can provide comprehensive consulting services from equipment development to production line construction based on your process requirements.





